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| PRODUCT DATA of Eccobond Solder 56C |
| Material | Eccobond Solder 56C |
| Product Datasheet | ECCOBOND56C |
| Product Type | Electrically-conductive adhesive paste |
| Chemical Composition | Epoxy-Silver-loaded |
| Name of Manufacturer | Emerson & Cumming |
| EXPERIENCE IN PRACTICE |
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| Development Status | Commercial product |
| Cost Range | high |
| Lot Reproducibility | Excelent |
| Space Experience | Extensive |
| ELECTRICAL PROPERTIES |
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| Electrical Volume Resistivity | 2 x 10-6 ohm.m |
| THERMAL PROPERTIES |
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| Thermal Conductivity | 5.8 W/m.K Data Quality: Manufacturer's data |
| Thermal Expansion Coefficient | 36 μstrain/°C Data Quality: Manufacturer's data |
| RELEVANT PROPERTIES FOR USE IN SPACE COMMUNITY |
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| Flammability | Pass (23.8% O2) Test: NASA NHB 8060-1B |
| Toxicity/Offgassing | Pass Test:NASA NHB 8060-1A |
| Temperature Range(space) | -60°C to +175°C. Data Quality: Manufacturer's data |
| Outgassing(Avg data) | TML = 0.30%, RML =0.20%, CVCM = 0.02% Test: ECSS-Q-70-02 |
| SPECIAL RECOMMENDATIONS |
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| Special Recommendations | Recommended proportions are: 100 pbw resin + 2.5 pbw catalyst 9.
Recommended cure is 16 hours at 50°C. Peel strength of this adhesive is low. Cycling to subzero temperatures can be detrimental. Electrical bonds made with this adhesive to metals having a different EMF are likely to degrade in a humid environment, particularly if the metal layers are thin (e.g. vacuum deposits). Different catalysts are available which will affect the properties, including temperature range and processing recommendations. Space experience with catalysts 9 and 11 is available. |